eASIC Corp. (www.easic.com) (@easic), a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), today announced that it has joined the Hybrid Memory Cube Consortium (http://goo.gl/fu1HTY). The organization includes more than 150 members dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC, http://goo.gl/fu1HTY) technology.
“eASIC is delighted to join the HMC Consortium as a key contributor to the advancement of an industry standard interface which is being adopted in the market place for high performance storage and data center designs,” said Jasbinder Bhoot, Vice President of Worldwide Marketing at eASIC. “HMC technology is overcoming the limitations of current and near-term memory architectures to deliver greater levels of bandwidth, power efficiency and reliability, proving a good match for stringent system-level design requirements.”
The HMC Consortium is a working group made up of industry leaders that build, design-in or enable HMC memory technology. The goal of the consortium is to facilitate HMC integration into a wide variety of systems, platforms and applications by defining an adoptable, industry-wide interface that enables developers and manufacturers to innovate and expand the capabilities of the next generation of memory-based solutions.
